Laminar structure comprising organic material and inorganic material

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United States of America Patent

PATENT NO 5084355
SERIAL NO

07336788

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Abstract

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A laminar structure comprising an organic material and an inorganic material; for example, a coating structure on an organic substrate comprising an organic material on which an inorganic film must be formed and a method of producing the structure, a structure which is suitable for increasing the reliability of an optical disk and a method of producing this, a wiring structure on an organic substrate comprising the organic material on which electric wiring must be formed and a method of producing this, and a structure suitable for increasing the reliability of a semiconductor integrated circuit device and a method of producing this. In order to provide a laminar structure which exhibits a high degree of reliability with respect to prevention of cracks or separation and which comprises an organic material and an inorganic material and a method of producing this structure and a device which utilizes this structure, the present invention provides a laminar structure on an organic substrate comprising the organic substrate comprising an organic material and a thin film which is caused to adhere to the surface of the organic substrate and which comprises an inorganic material a second element which produces a metal bonding or covalent bonding with the first element that forms the thin film being contained in the organic substrate in the vicinity of the surface thereof.

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Patent Owner(s)

Patent OwnerAddress
HITACHI LTD A CORP OF JAPAN6 KANDA SURUGADAI 4-CHOME CHIYODA-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fukuda, Takuya Hitachi, JP 83 1052
Misawa, Yutaka Katsuta, JP 19 391
Momma, Naohiro Hitachi, JP 24 1011
Ohue, Michio Hitachi, JP 17 297
Satoh, Toshiya Hitachi, JP 85 1535
Takahashi, Shigeru Hitachiota, JP 67 1327
Tanno, Seikichi Hitachi, JP 23 171

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