Connecting structure of electronic part and electronic device using the structure
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United States of America Patent
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Feb 4, 1992
Issued Date -
N/A
app pub date -
Sep 13, 1988
filing date -
Jan 19, 1987
priority date (Note) -
Expired
status (Latency Note)
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Abstract
This invention relates to a connecting structure for electrically connecting an electronic part such as an LSI chip to a substrate, its production method and an electronic device using the former. The present invention is particularly useful for connecting electrically a plurality of chips, for which an absorption function of the difference of thermal expansion in a horizontal direction and capability of displacement in a vertical direction are requisite, to a substrate. Moreover, the connecting structure of the present invention can simplify the fabrication process, has high reliability and can be applied to high performance electronic appliances and apparatuses such as electronic computers.
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