Electronic manufacturing process
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United States of America Patent
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-
Feb 18, 1992
Issued Date -
N/A
app pub date -
Feb 28, 1991
filing date -
Aug 31, 1990
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A solder paste flux comprising an epoxy resin, a carboxylic acid, a substantially solid alcohol, cellulose, a catalyst, a solvent for the carboxylic acid and a synthetic resin; a solder paste incorporating this solder paste flux; and a surface mount electronic manufacturing process utilizing the solder paste.
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Cited Art Landscape
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