Method for improving electric conductivity of a resin molding

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United States of America Patent

PATENT NO 5089199
SERIAL NO

07580200

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Abstract

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A resin molding having a very improved electric conductivity is obtained by the steps of mixing with a resin a complex of a polyether and an electrolyte salt soluble in the polyether, modling the mixture and then treating the resultant molding with plasma. The polyether is selected from the group consisting of alkylene oxide polymers and copolymers, preferably selected from the group consisting of polymers of alkylene oxide having not less than 4 carbon atoms and block or random alkylene oxide copolymers containing not less than 10 weight % of at least one alkylene oxide unit having not less than 4 carbon atoms.

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Patent Owner(s)

Patent OwnerAddress
DAI-ICHI KOGYO SEIYAKU CO LTD A CORP OF JAPAN55 HIGASHI-KUBOCHO NISHI-HICHIJYO SHIMOGYO-KU KYOTO
KANTO JIDOSHA KOGYO KABUSHIKI KAISHA A CORP OF JAPANTAURAMINATOMACHI YOKOSUKA-SHI KANAGAWA-KEN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujiwara, Hidekazu Yokohama, JP 6 10
Mori, Shigeo Kyoto, JP 117 1196
Motogami, Kenji Takatsuki, JP 11 71

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