Ultrasonic array with a high density of electrical connections
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United States of America Patent
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Feb 25, 1992
Grant Date -
N/A
app pub date -
Apr 5, 1990
filing date -
Apr 5, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A piezoelectric ultrasonic array transducer has its individual elements connected to external electronics via a high density interconnect structure which facilitates signal connection and uniformity from array-to-array. The array fabrication process is preferably modified for use with a high density interconnect structure in order to obtain maximum transducer quality.
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