Aromatic polyimides containing a dimethylsilane-linked dianhydride
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United States of America Patent
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Mar 3, 1992
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N/A
app pub date -
Dec 12, 1989
filing date -
Dec 12, 1989
priority date (Note) -
Expired
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Abstract
A high-temperature stable, optically transparent, low dielectric aromatic polyimide is prepared by chemically combining equimolar quantities of an aromatic dianhydride reactant and an aromatic diamine reactant, which are selected so that one reactant contains at least one Si(CH.sub.3).sub.2 group in its molecular structure, and the other reactant contains at least one --CH.sub.3 group in its molecular structure. The reactants are chemically combined in a solvent medium to form a solution of a high molecular weight polyamic acid, which is then converted to the corresponding polyimide.
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