Method and apparatus for applying a layer of a fluid material on a semiconductor wafer
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United States of America Patent
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Mar 10, 1992
Issued Date -
N/A
app pub date -
Apr 24, 1990
filing date -
Apr 24, 1990
priority date (Note) -
Expired
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Abstract
An apparatus and method is disclosed for applying a uniform layer of a fluid material such as photoresist onto the surface of a rotating workpiece such as a semiconductor wafer. A dispensing nozzle is provided with a rectangular or oblong shaped opening for painting a broad swath of the fluid material onto the surface of the workpiece while the nozzle moves along a radial path inwardly from the peripheral edge of the workpiece. The use of a rectangular or oblong shaped nozzle opening minimizes the amount of fluid material being consumed while providing a uniform thin film coating on the workpiece surface.
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