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Abstract

A process for producing a copper-clad laminate is disclosed which includes the steps of (a) contacting the surface of a conductive carrier with a catalyst liquid containing at least one noble metal selected from the group consisting of Pd, Pt, Ru, Au, and Ag; (b) subsequently forming a copper foil layer on the treated surface of the conductive carrier by copper electroplating; (c) laminating an insulating base on the copper foil layer by hot-press bonding; and (d) separating the conductive carrier from the resulting laminate. The copper foil layer in the resulting copper-clad laminate has reduced pinholes and exhibits isotropic mechanical characteristics.

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First Claim