Diffusion-bonded assembly of AlN ceramic bodies and heat dissipation member constituted thereby
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United States of America Patent
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Mar 17, 1992
Issued Date -
N/A
app pub date -
Jun 5, 1991
filing date -
Nov 4, 1988
priority date (Note) -
Expired
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Abstract
A diffusion-bonded assembly of AlN ceramic bodies, at least one of the AlN ceramic bodies having a boundary phase content of 1000 ppm or more. A heat dissipation member constituted by diffusion-bonded AlN ceramic bodies, at least one of the AlN ceramic bodies having a boundary phase content of 1000 ppm or more.
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