Method of forming a conductive contact bump on a flexible substrate and a flexible substrate
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United States of America Patent
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Mar 17, 1992
Grant Date -
N/A
app pub date -
Feb 5, 1991
filing date -
Feb 5, 1991
priority date (Note) -
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Abstract
A flexible circuit board is formed from a sheet of polyimide having a contact pad on its first side and a continuous layer of copper on its second side by removing copper from the second side so as to leave at least one discrete island that confronts the pad through the sheet of insulating material, and applying force to the island in the direction from the second side toward the first side, whereby the island is deformed plastically to form a dimple and the pad is deformed plastically to form a bump.
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