Heat actuated fuse apparatus with solder link
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United States of America Patent
Stats
-
Mar 17, 1992
Grant Date -
N/A
app pub date -
Jun 3, 1991
filing date -
Jun 3, 1991
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An apparatus for protecting circuitry includes a heat actuated fuse which opens at a predetermined temperature and a resistive device disposed proximate the fuse for heating the fuse in response to an electrical current passed through the device. The fuse includes first and second electrodes bridged by a solder link which melts at the predetermined temperature and retreats to the electrodes. A quantity of flux-containing material is disposed on the link to promote rapid and complete retreat of the solder when the fuse is actuated.
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