Method for joining joint portions of electromagnetic wave shielding materials

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United States of America Patent

PATENT NO 5098009
SERIAL NO

07677132

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A novel method for joining edge portions of electromagnetic wave shielding members is proposed. A joiner is prepared by solder-plating a surface of a narrow strip of electromagnetic wave shielding material of a metal foil or a metal sheet. The respective edge portions of adjacent electromagnetic wave shielding members made of metal sheets or metal foils are butted against each other. The solder-plated surface of the prepared joiner is superposed on the respective abutting edge portions of the electromagnetic wave shielding members. Thereafter, while the joiner is being pressed against the shielding members by a heater, the joiner is solder-welded to both of the electromagnetic wave shielding members via the solder-plated layer.

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Patent Owner(s)

Patent OwnerAddress
ABC TRADING CO LTD 12-14 NAGATA-CHO 2-CHOME CHIYODA-KU TOKYO JAPANNot Provided
FUJITA CORPORATION 6-15 SENDAGAYA 4-CHOME SHIBUYA-KU TOKYO JAPANNot Provided

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Isoyama, Ryoichi Tokyo, JP 2 19
Ito, Kei Toda, JP 37 282
Matsui, Teruo Yokohama, JP 5 53
Onishi, Kazumasa Toda, JP 8 196
Tsuchida, Yasuyoshi Tokyo, JP 2 19
Ueno, Hiroo Yokohama, JP 2 5

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