Stacked tab leadframe assembly
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United States of America Patent
Stats
-
Mar 24, 1992
Issued Date -
N/A
app pub date -
Mar 26, 1991
filing date -
Nov 21, 1988
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Disclosed is a stacked leadframe assembly for use with integrated circuit chips. The assembly comprises multiple leadframes arranged in stacked relation. Each leadframe comprises conductive elements and solder bumps for electrically and mechanically connecting selected conductive elements of the leadframes.
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