Microwave integrated circuit package to eliminate alumina substrate cracking and method
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United States of America Patent
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Apr 7, 1992
Grant Date -
N/A
app pub date -
Jun 22, 1990
filing date -
Jun 22, 1990
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A MIC package housing that reduces or completely eliminates alumina substrate cracking due to thermal expansion rate differences between the housing and the alumina by using a low-expansion iron-nickel alloy, such as commercially available Carpenter 49, made to ASTM Specification A-753-78 (Alloy 2) and MIL-N-14411B (MR) (Composition 3 and 4). Such a housing places compressive stresses on glass-to-metal seals used in hermetic feedthroughs and the glass is fused and the stresses relieved by a special process of annealing. Manufacturing yields are improved and very large alumina substrates can be used and are attached by hard soldering.
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