Resist stripping
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United States of America Patent
Stats
-
Apr 7, 1992
Grant Date -
N/A
app pub date -
Feb 1, 1990
filing date -
Feb 1, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A positive photoresist stripper composition includes a solvent system having solubility parameters which fall within a range from about 8.5 to about 15 in an amount which falls within a range from about 65% to about 98%. An amine is present in an amount which falls within a range from about 2% to about 25%. A fatty acid having 8 to 20 carbon atoms is present in an amount which falls within a range from about 0.1% to about 10% (all percents being by weight). The amount of the amine and of the fatty acid are selected to provide a pH which falls in a range from about 6 to about 9.5. Positive photoresist is stripped from a substrate by immersing the substrate in the aforementioned composition. Metal deposited on the substrate is not attached by the composition.
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