X-Y multiplex drive circuit and associated ink feed connection for maximizing packing density on thermal ink jet (TIJ) printheads
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United States of America Patent
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Apr 7, 1992
Issued Date -
N/A
app pub date -
Feb 15, 1991
filing date -
Dec 11, 1989
priority date (Note) -
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status (Latency Note)
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Abstract
A X-Y multiplex drive circuit and associated ink feed arrangement for an ink jet printhead wherein resistive heater elements, X-Y electrical interconnects thereto and closely adjacent ink feed ports are integrated on or within a given printhead substrate surface area with a maximum packing density and a minimum of fluidic crosstalk. Ink feed channels are formed within a printhead barrier layer which separates an ink jet orifice plate from an underlying printhead substrate, and state-of-the-art MOS planar processes and thin film deposition processes may be used for fabricating this drive circuit and its associated ink feed arrangement.
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