Electronic circuit packages with tear resistant organic cores
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United States of America Patent
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Apr 7, 1992
Grant Date -
N/A
app pub date -
Dec 7, 1990
filing date -
Dec 7, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Disclosed are an electronic package and electronic package module. The module has a dielectric core with surface circuitization on at least one surface. The dielectric core is a composite having a thermoplastic layer interposed between two separate layers of thermoset adhesive, as epoxy dicyanate adhesive. The thermoplastic layer is preferably a polyimide. The adhesive is preferably an epoxy or dicyanate adhesive, for example a homogeneous film of thermoset resin, or a fiber reinforced thermoset resin, such as a polytetrafluorethylene reinforced epoxy or a glass fiber reinforced adhesive. The use of a thermoplastic polyimide layer interposed between adhesive layers provides a core that is particularly amenable to manufacture as a thin core.
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