MMIC die attach design for manufacturability
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United States of America Patent
Stats
-
Apr 14, 1992
Grant Date -
N/A
app pub date -
Jan 10, 1990
filing date -
Jan 10, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An improved semiconductor device for use in microwave integrated circuits is disclosed. In particular, an improved monolithic integrated circuit (10) comprised of a semi-insulating substrate (12) and having an integrated circuit on a top surface (14) thereof. MMIC (10) is provided with free area (38) of a predetermined width extending along the entire periphery or at least two opposing sides and which is void of active circuitry. Free area (38) permits intimate mating contact with a die collet tool (58). Die collet tool (58) has a surface configured to matingly engage free areas (38) while avoiding contact with the active circuitry so as to avoid damage thereto. MMIC (10) permits application of high volume, automated manufacturing processes which previously could not be utilized.
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