Methods of joining components
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United States of America Patent
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Apr 21, 1992
Grant Date -
N/A
app pub date -
Sep 4, 1990
filing date -
Sep 6, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of joining components by soldering comprising forming discrete layers of silver (13, 17) and another metal (19), e.g. a tin or indium based material, the two layers having volumes in a ratio different from that in the eutectic alloy formed by silver and that metal, and raising the temperature of the layers above the melting point of the eutectic alloy for a period sufficient to cause initially formation of the eutectic alloy and then, by reaction between the eutectic alloy and one or other of silver and the other metal, formation of a material having a melting point higher than the eutectic alloy melting point. The method allows soldering, e.g. of a silicon wafer (1) to a header (3), at a relatively low temperature below that which the joint will withstand after formation.
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