Thermal flow sensor
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United States of America Patent
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-
Apr 28, 1992
Issued Date -
N/A
app pub date -
Jan 23, 1991
filing date -
Aug 20, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A thermal flow sensor comprising a substrate which can be etched, an electrical insulating film which is formed on said substrate and which has an etching characteristic different from that of said substrate, a heating resistor which is disposed on said insulating film, and a fluid temperature sensing resistor which is disposed on said insulating film at a certain distance from said heating resistor, the portion of said substrate corresponding to at least one of the heating resistor and the fluid temperature sensing resistor and the vicinity thereof being etched.
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