Via formation method for multilayer interconnect board
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United States of America Patent
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-
Apr 28, 1992
Grant Date -
N/A
app pub date -
Sep 15, 1989
filing date -
Sep 15, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of boring holes in a circuit board assembly of the type having a first layer of material which is primarily reflective of light of a first light wavelength and having a second layer of material, overlying the first layer of material, which is primarily absorptive of light of the first light wavelength, comprising: tuning the frequency of a laser cutting device to the first light wavelength; directing a laser beam from the tuned laser cutting device onto the second layer of material in a region where a hole is to be provided; and terminating application of the laser beam after a hole has been bored through the second layer of material.
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