Curable dielectric polyphenylene ether-polyepoxide compositions useful in printed circuit board production
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United States of America Patent
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Apr 28, 1992
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N/A
app pub date -
May 20, 1991
filing date -
Dec 22, 1988
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Abstract
Curable compositions containing a polyphenylene ether and a polyepoxide composition containing brominated and non-brominated bisphenol polyglycidyl ethers, in combination with further components including specific catalysts and hardeners, may be used in the preparation of laminates useful as printed circuit boards and bonding sheets therefor and having excellent physical and electrical properties.
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