Method of making a resin encapsulated pin grid array with integral heatsink
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United States of America Patent
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Apr 28, 1992
Issued Date -
N/A
app pub date -
Feb 6, 1991
filing date -
Oct 27, 1988
priority date (Note) -
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Abstract
A method of making a resin encapsulated pin grid array which includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulating resin when the encapsulating resin is injection-molded.
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