Importance

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Abstract

Both a system and a method are provided for electrically and mechanically connecting at least one integrated circuit die to a solderless printed wiring board of the type which uses connecting interfaces which include an array of resilient electrical connector means held within a sheet of compliant, insulating material. The system of the invention generally comprises a fanout interface formed from a sheet of insulating material integrally connected to the side of an integrated circuit die that includes the bond pads associated with such dies, wherein the fanout interface includes an internal array of contact pads that are connected to the bond pads of the die, and an external array of contact pads on its exterior surface which are advantageously spaced farther apart than the bond pads of the die. The system further comprises a connecting interface having an array of resilient electrical connectors disposed between the external surface of the fanout interface of the die, and an array of contact pads mounted directly on the printed wiring board. Finally, a screw-type heat conductive retainer is provided in order to compress the resilient electrical connectors of the connecting interface into conducting engagement between the contact pads on the fanout interface and the printed wiring board.

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First Claim