Method of soldering components to printed circuit boards
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United States of America Patent
Stats
-
May 12, 1992
Issued Date -
N/A
app pub date -
Oct 22, 1990
filing date -
Oct 22, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The need for solder paste or wave soldering to assemble printed circuit boards and components is eliminated by applying (100) a layer of solder to the exposed metal pads, annular rings and plated through holes of the printed circuit board. Leadless components are placed into a layer of `tack` flux applied (110) to the printed circuit board (120). The printed circuit board is heated to reflow (130) leadless components, and the solder in the holes is melted (140). The leads of the leaded components are heated (150) and inserted (160) into the molten solder in the holes. The assembly is then cooled (170) to solidify the solder around the component.
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