High-speed, high-density chip mounting
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United States of America Patent
Stats
-
May 12, 1992
Grant Date -
N/A
app pub date -
Jan 24, 1991
filing date -
Jan 24, 1991
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electronic component assembly and method for enhancing density and operational speed. The assembly includes a plurality of integrated circuit chips which are mounted to a planar surface of a substrate, preferably a printed circuit board, with the opposed major faces of the chips being perpendicular to the planar surface. One of the major faces of each chip is the active face having a pattern of signal pads. The pads are disposed along the face periphery adjacent to the edge of the chip contacting the printed circuit board. The signal pads have solder bumps which can be soldered directly to contact pads on the printed circuit board. A passivating edge-coating on each chip protects the chip and prevents electrical shorting on the printed circuit board. A source of fluid directs a cooling flow along the large area major surfaces of the chips.
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