Method for fabricating multiple electronic devices within a single carrier structure
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United States of America Patent
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May 19, 1992
Issued Date -
N/A
app pub date -
May 28, 1991
filing date -
Jun 15, 1990
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The disclosed invention comprises multiple semiconductor devices within a single carrier structure. In accordance with one embodiment of the invention, a plurality of semiconductor die are coupled to the leads of a leadframe and are encapsulated by individual package bodies. A carrier structure is formed which encircles all of the die and encapsulates portions of the distal ends of the leads. The extreme distal portions of the leads extend through the carrier to form contact points which are used to access the semiconductor die. By having multiple devices within a single carrier, productivity is improved and costs associated with leadframe and carrier structure materials are reduced.
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