Process for manufacturing multilayer printed wiring board
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United States of America Patent
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-
May 26, 1992
Grant Date -
N/A
app pub date -
Feb 6, 1990
filing date -
Aug 9, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In manufacturing multilayer printed wiring boards with a cavity for mounting an electronic device, a rubber or composite rubber sheet is mounted in the cavity to prevent a prepreg resin from flowing into the cavity. The rubber sheet or composite rubber sheet is removed after applying pressure and temperature to an assembly consisting of boards to be bonded and the prepreg between them. This eliminates poor bonding which can result when resin flows into the cavity.
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Cited Art Landscape
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