Electronic substrate multiple location conductor attachment technology
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 26, 1992
Grant Date -
N/A
app pub date -
Oct 24, 1990
filing date -
Oct 24, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A conductor attachment wherein each conductor is mounted on a dielectric tape and has an attachment portion that is supported by the tape to an adjacent location a uniform distance from the bonding location and that contacts on a level with the plane of the underside of the tape. One conductor supporting tape has portions of the tape that extend into a central contacting area opening to contact locations at contacting pads in rows remote from the edge. Another supporting tape has window openings at the contacting locations. The conductor ends are brought into the level of the underside of the tape by a manufacturing rolling operation between an elastomer surface roller and a solid backing roller.
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