Printed circuit board having bumps and method of forming bumps
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 2, 1992
Grant Date -
N/A
app pub date -
Dec 18, 1989
filing date -
May 26, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A printed circuit board having a plurality of bumps that serve for connection terminals, the bumps being formed by covering the printed circuit except portions where the bumps are to be formed, applying an electroplating onto the uncovered bump-forming portions on the printed circuit maintaining a thickness nearly equal to that of the covering, applying thereon a non-electrolytic plating and electroplating on the whole surface from the surfaces of the bump-forming portions to the surfaces of the covered portions, and removing the platings by etching from the surface except the bump portions.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully