Importance

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Abstract

Molded carrier ring-type electrical components are unloaded from a shipping tube by providing the bottom of an escapement mechanism with a substantially flat surface to which the 'coin stack' arrangement of components falls during loading of the stack into the escapement. This flat surface presents to the bottom component of the stack an area which is sufficient for preventing dumping of the stack through the escapement and for releveling components which become tilted during loading of the tube into the escapement. The flat surface is biased upwardly by springs and displaceable downwardly against such biasing by a component transfer slide during lateral displacement of the transfer slide to the stack in order to acquire and remove the bottom component from the stack. The slide is particularly configured so that it does not substantially protrude beyond any more than one side of the stack during use, thus providing an unloading main frame that can accommodate an increased density of the stacks for unloading thereof.

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First Claim