High thermal conductivity metal matrix composite
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United States of America Patent
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Jun 9, 1992
Issued Date -
N/A
app pub date -
Jun 3, 1991
filing date -
Aug 27, 1990
priority date (Note) -
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Abstract
A thermally conductive diamond metal composite comprising 5 to 80 volume percent diamond particles having a particle size ranging from about 1 to 50 .mu.m and a metal matrix comprising a thermally conductive metal. Preferably, a fine metal powder having particle size below 53 microns is utilized as the source for the metal matrix.
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