Method of fabricating electrical components in high density substrates
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United States of America Patent
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Jun 9, 1992
Grant Date -
N/A
app pub date -
Oct 30, 1990
filing date -
Oct 30, 1990
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A process for fabricating integrated resistors in high density interconnect substrates for multi-chip modules. In addition, the resistor material can be connected selectively into an insulator for optionally allowing for the simultaneous fabrication of integrated resistors and capacitors in relatively few steps. The process is well suited for cooper/polyimide substrates.
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