Method of using an anisotropically electroconductive adhesive having pressure-deformable electroconductive particles to electrically connect circuits
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United States of America Patent
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Jun 9, 1992
Issued Date -
N/A
app pub date -
Mar 19, 1991
filing date -
Dec 5, 1988
priority date (Note) -
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status (Latency Note)
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Abstract
A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particle size larger than that of the particles (B), and if necessary (D) rigid particles having an average particle size smaller than that of the particles (B). Also, a method of using for the composition connecting circuits electrically or connecting a semiconductor chip to a wiring substrate.
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