Circuit pack cooling using perforations
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United States of America Patent
Stats
-
Jun 9, 1992
Grant Date -
N/A
app pub date -
Jun 25, 1990
filing date -
Jun 25, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Disclosed is an apparatus for providing forced air cooling of components mounted on circuit boards in a stacked configuration. A plurality of perforations is provided in the circuit boards so that air flow in the channel between boards causes air to be sucked through the perforations to eliminate stagnant areas between components and provide local jet impingement cooling.
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