Integrated circuit device and manufacturing method thereof
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United States of America Patent
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-
Jun 16, 1992
Issued Date -
N/A
app pub date -
Sep 20, 1990
filing date -
Aug 26, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Provided is an integrated circuit device is used in an IC card or the like, and a manufacturing method of the integrated circuit device, having a thin thickness so as to be capable of being manufactured highly accurately in dimensions and highly efficiently. The integrated circuit element (12) is mounted on one surface of the thin metal plates (11) having the other surface which at least part serves as a plurality of external connecting terminals (11a) and, on one surface side, the integrated circuit element (12) is covererd with a sealing resin (15).
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