Ceramic lid for sealing semiconductor element and method of manufacturing the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 16, 1992
Grant Date -
N/A
app pub date -
Mar 14, 1990
filing date -
Mar 15, 1989
priority date (Note) -
Expired
status (Latency Note)
A preliminary load of PAIR data current through [] has been loaded. Any more recent PAIR data will be loaded within twenty-four hours. |
PAIR data current through []
A preliminary load of cached data will be loaded soon.
Any more recent PAIR data will be loaded within twenty-four hours.
Next PAIR Update Scheduled on [ ] |
Importance
US Family Size
|
Non-US Coverage
|
Patent Longevity
|
Forward Citations
|
Abstract
A ceramic lid for sealing a semiconductor element and having a sealing surface which is to seal a semiconductor element within a recess of a ceramic package, by heating the recess with glass sealant and hermetically sealing the semiconductor element. The ceramic lid is made of alumina of high purity and to the sealing surface of the ceramic lid is applied a glass sealing aid which is pretreated at a higher temperature than the heating temperature for sealing the semiconductor element, before hermetically sealing the semiconductor element in the ceramic package. A method of manufacturing a ceramic lid for sealing a semiconductor element includes the steps of manufacturing the ceramic lid with alumina of high purity having a sealing surface with the recess of the ceramic package, wherein to the sealing surface of the ceramic lid is applied a glass sealing aid of 5-30 .mu.m in thickness onto a sealing surface of the ceramic lid with the ceramic package. The ceramic lid is heat-treated at a higher temperature than the sealing temperature of the semiconductor element. Thereafter a glass sealant is applied and dried on the glass sealing aid layer, and then calcined at a temperature lower than the airtight sealing temperature of the semiconductor element, thereby removing an organic binder contained in the glass sealant. A semiconductor element is then housed within a recess of the ceramic package and the ceramic lid and a glass sealant are heated to hermetically seal the ceramic lid with the semiconductor element in the recess to the ceramic package.
First Claim
Family
- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
- NGK INSULATORS, LTD.
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Kajihara, Takehiro | Komaki, JP | 15 | 149 |
Maekawa, Koichiro | Ichinomiya, JP | 7 | 261 |
Ohashi, Toshio | Komaki, JP | 65 | 845 |
Cited Art Landscape
- No Cited Art to Display
Patent Citation Ranking
Forward Cite Landscape
- No Forward Cites to Display
Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text
Legal Events
Matter Detail
Update Public Data Dismiss Edit SaveRenewals Detail
Edit SaveNote
The template below is formatted to ensure compatibility with our system.
Provide tags with | separated like (tags1|tags2).
Maximum length is 128 characters for Customer Application No
Mandatory Fields * - 'MatterType','AppType','Country','Title','SerialNo'.
Acceptable Date Format - 'MM/DD/YYYY'.
Acceptable Filing/App Types -
- Continuation/Divisional
- Original
- Paris Convention
- PCT National
- With Priority
- EP Validation
- Provisional Conversion
- Reissue
- Provisional
- Foreign Extension
Acceptable Status -
- Pending
- Abandoned
- Unfiled
- Expired
- Granted
Acceptable Matter Types -
- Patent
- Utility Model
- Supplemental Protection Certificate
- Design
- Inventor Certificate
- Plant
- Statutory Invention Reg
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Success
E-mail has been sent successfully.
Failure
Some error occured while sending email. Please check e-mail and try again!
PAIR load has been initiated
A preliminary load of cached data will be loaded soon. Current PAIR data will be loaded within twenty four hours.
File History PDF
Thank you for your purchase! The File Wrapper for Patent Number 5122862 will be available within the next 24 hours.
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully
Important Notes on Latency of Status data
Please note there is up to 60 days of latency in this Status indicator for certain status conditions. You can obtain up-to-date Status indicator readings by ordering PAIR for the file.
An application with the status "Published" (which means it is pending) may be recently abandoned, but not yet updated to reflect its abandoned status. However, an application filed less than one year ago is unlikely to be abandoned.
A patent with the status "Granted" may be recently expired, but not yet updated to reflect its expired status. However, it is highly unlikely a patent less than 3.5 years old would be expired.
An application with the status "Abandoned" is almost always current, but there is a small chance it was recently revived and the status not yet updated.
Important Note on Priority Date data
This priority date is an estimated earliest priority date and is purely an estimation. This date should not be taken as legal conclusion. No representations are made as to the accuracy of the date listed. Please consult a legal professional before relying on this date.
We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level. Upgrade to our Level for up to -1 portfolios!.