Non-destructive burn-in test socket for integrated circuit die
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United States of America Patent
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Jun 23, 1992
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N/A
app pub date -
Jun 7, 1991
filing date -
Apr 6, 1990
priority date (Note) -
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Abstract
Disclosed is a burn-in test socket which serves as a temporary package for integrated circuit die, multichip hybrid or a complete wafer without damaging the bonding pads or insulating passivation on the die during test and burn-in.
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