Resin-bonding method
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United States of America Patent
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-
Jun 23, 1992
Grant Date -
N/A
app pub date -
Jun 11, 1990
filing date -
Jun 14, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Disclosed herein is a method for bonding a resin part, which comprises disposing a magnetic complex composed of a resin and magnetic particles as a heating-medium at the resin parts to be bonded, and applying an alternating magnetic field to the heating-medium by using a magnetic field generating means composed of an electromagnetic core and an exciting coil, thereby making said heating-medium generate heat for fuse-bonding said resins.
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