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Abstract

A monolithic multi-layer capacitor having a central capacitively active area and two electrode joining section separated from the active area by sloped sections has dielectric layers about 1 micron thick in the active area which taper gradually to zero thickness in the sloped sections. Electrode layers in the active area have a thickness in the range from 200 to 500 Angstroms and sufficient thickness throughout the sloped sections for adequate current carrying capacity. Various acrylates are used for the dielectric layers, the number of layers ranging from a few to many thousands. Apparatus and methods for the fabrication of such capacitors on a high speed, production scale basis employ techniques for the flash evaporation of highly reactive monomers of acrylate dielectric materials. The vapor is controllably directed to a deposition surface for condensation and subsequent curing by a field enhanced gas discharge electron beam source. The control of the dielectric vapor is accomplished by adjacent gas streams of an inert gas directed to areas of the deposition surface where deposition of the electrode material is unwanted. Monomers of the dielectric material are ultrasonically atomized in preparation for flash evaporation.

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First Claim