Sputter coating process control method and apparatus

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5126028
SERIAL NO

07570943

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A sputter coating apparatus displays set and alternative machine parameters, entered or calculated from entered or measured data, for selection by the operator. The apparatus performs a sputter coating process to produce sputter coated articles in accordance with the selected machine parameters. Process parameters familiar to the person creating the process, such as desired coating thickness and desired deposition rate, may be entered by the operator. Measured data such as actual coating thickness at a plurality of points on a previously processed wafer may be entered by an operator or automatically measured from a wafer. Alternative machine parameters such as target sputtering power may be entered by an operator or calculated from entered process parameters or measured data. The operator selects and initiates a process in accordance with the selections by entering commands. The machine parameters control separately the sputtering from different regions of the sputtering surface of a one piece sputtering target by alternately energizing different plasmas over the different target regions and energizing the target in accordance with different machine parameters.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
TOKYO ELECTRON LIMITEDTOKYO5271

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Edwards, Richard C Ringwood, NJ 15 575
Hieronymi, Robert Rock Cavern, NY 6 223
Hurwitt, Steven D Park Ridge, NJ 19 710
Messina, Donald A Valley Cottage, NY 1 62
Van, Nutt Charles Monroe, NY 4 204
Wagner, Israel Monsey, NY 19 380

Cited Art Landscape

Patent Info (Count) # Cites Year
 
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TOKYO ELECTRON LIMITED (1)
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Leybold Aktiengesellschaft (1)
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Tokyo Road Engineering Co., Ltd. (1)
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* Cited By Examiner

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
Other [Check patent profile for assignment information] (1)
* 2004/0152,301 Method and apparatus for forming improved metal interconnects 4 2004
 
ADVANCED MICRO DEVICES, INC. (3)
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COGISCAN INC. (4)
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GLOBALFOUNDRIES INC. (2)
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6376261 Method for varying nitride strip makeup process based on field oxide loss and defect count 10 2000
 
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. (2)
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Sony Electronics Inc. (1)
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4WAVE, INC. (2)
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Atlas Sound LP (1)
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OERLIKON ADVANCED TECHNOLOGIES AG (4)
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COATING INDUSTRIES INVESTMENT CORP. (1)
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NATIONAL RESEARCH COUNCIL OF CANADA (1)
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APPLIED MATERIALS, INC. (16)
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6197167 Step coverage and overhang improvement by pedestal bias voltage modulation 60 1999
* 6344419 Pulsed-mode RF bias for sidewall coverage improvement 81 1999
6554979 Method and apparatus for bias deposition in a modulating electric field 26 2001
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6559061 Method and apparatus for forming improved metal interconnects 40 2001
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6746591 ECP gap fill by modulating the voltate on the seed layer to increase copper concentration inside feature 7 2001
6673724 Pulsed-mode RF bias for side-wall coverage improvement 17 2001
6709987 Method and apparatus for forming improved metal interconnects 34 2002
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6992012 Method and apparatus for forming improved metal interconnects 24 2004
* 2008/0017,501 COOLED DARK SPACE SHIELD FOR MULTI-CATHODE DESIGN 0 2007
 
UNIVERSITY OF SOUTH FLORIDA (1)
* 8597473 Reactive physical vapor deposition with sequential reactive gas injection 0 2005
 
SHOWA DENKO K.K. (1)
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ANELVA CORPORATION (1)
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The United States of America as represented by the Secretary of the Air Force (1)
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LIFE TECHNOLOGIES AS (3)
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7989614 Isolation of nucleic acid 23 2008
8691969 Isolation of nucleic acid 0 2011
 
TOKYO ELECTRON LIMITED (3)
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STMICROELECTRONICS NV (1)
* 6746577 Method and apparatus for thickness control and reproducibility of dielectric film deposition 2 1999
* Cited By Examiner