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Abstract

A process for producing a printed circuit board includes steps, sequentially conducted of dispersing in water or organic solvent: (A) 95 to 20% by weight of a styrene polymer having a syndiotactic structure, (B) 5 to 80% by weight of a fibrous filler having a fiber length of 1 to 50 mm, and (C) 0.1 to 30 parts by weight of at least one of a binder and a binding fiber in proportion to 100 parts by weight of the total amount of the components (A) and (B), to make a slurry having a concentration of 0.5 to 100 g/l; separating the solids from the slurry and drying and molding them. Thereafter the solids are either subjected to melting with heating and pressure forming into the molded article, or they are impregnated with a thermoplastic resin which is then cured. Finally, a metal layer is provided on the molded article.

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