Flexible automated bonding method and apparatus
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United States of America Patent
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-
Jul 7, 1992
Issued Date -
N/A
app pub date -
Jun 28, 1990
filing date -
Jun 28, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A flexible automated bonding apparatus electrically interconnects integrated circuit carriers, printed circuit boards, and other devices. A metallized interconnect pattern is deposited on the surface of the substrate. The metallized interconnects in the pattern span apertures created in the substrate using an excimer laser. Thus, the metallized interconnects can be electrically bonded through the apertures to elements lying underneath the substrate.
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Cited Art Landscape
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