Epoxy-modified encapsulation composition
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United States of America Patent
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Jul 7, 1992
Issued Date -
N/A
app pub date -
Aug 15, 1988
filing date -
Oct 16, 1985
priority date (Note) -
Expired
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Abstract
Epoxy-grafted, low molecular weight amorphous polymer compositions are employed in pourable, liquid telecommunication cable encapsulation compositions. Also disclosed is a method for encapsulating telecommunication cables as well as cables encapsulated with such an epoxy-grafted liquid encapsulant.
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