Importance

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Abstract

A disposable integrated circuit test head (34) communicates a plurality of test signals between test nodes (20) of an integrated circuit and test circuitry. Disposable high-density test head (30) comprises signal platform (24) which includes tape layer (24) and interconnection lines (28). Interconnection lines (28) include signal leads (30) and bumps (32). Interconnection lines (28) coupled with test nodes (20) to electrically connect test nodes (20) with the test circuitry and communicate test signals between test nodes (20) and the test circuitry. Pusher block (36) engages signal platform (24) at tape layer (26) opposite interconnection lines (28) and applies force through tape layer (24) to interconnection lines (28). This allows positive engagement of interconnection lines (28) with test nodes (20). Pusher block (36) comprises rigid force applying plate (38) which adheres to compliant layer (40) at junction (42). Compliant layer (40) absorbs planarity differences between interconnection lines (28) and integrated circuit test nodes (20).

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First Claim