Encapsulated circuitized power core alignment and lamination
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United States of America Patent
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-
Jul 14, 1992
Grant Date -
N/A
app pub date -
Oct 30, 1990
filing date -
Oct 30, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A structure and method are disclosed for making high density circuit board. Using photosensitive or other dielectric materials over a circuitized power core, vias and lands are opened up, filled with joining metal and aligned with the next level, eliminating a major registration problem in building up a high density composite and reducing the number of steps in the manufacturing process.
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Cited Art Landscape
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