Method of fabricating surface micromachined structures
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United States of America Patent
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Jul 14, 1992
Grant Date -
N/A
app pub date -
May 16, 1991
filing date -
May 16, 1991
priority date (Note) -
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Abstract
A method of fabricating a surface micromachined structure is comprised of the steps of providing a semiconductor substrate having a dynamic element partially supported above the semiconductor substrate by a release layer and having a metal contact layer disposed on the dynamic element, forming a protection layer over the metal contact layer, and removing the release layer and the protection layer with an etchant that etches the protection layer at a slower rate than the release layer.
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