Solder mass having conductive encapsulating arrangement
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United States of America Patent
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-
Jul 14, 1992
Issued Date -
N/A
app pub date -
Jun 19, 1990
filing date -
Jun 19, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention relates generally to a new interconnection and a method for making the same, and more particularly, to an elongated solder interconnection and a method for making the same. On an electronic carrier, a pad is formed on which a solder mass is deposited and capped with a metal layer, thereby forming an elongated solder interconnection. A further elongated solder interconnection can now be formed by forming a second solder mass on the first solder mass that has been capped by a metal layer. Additional elongated solder interconnection can be formed by capping the preceding solder mass and/or the last solder mass with a metal capping layer. Alternatively, the encapsulating layer can be in the form of a sidewall spacer formed on the sidewalls of the solder mass.
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