Flexible film semiconductor package
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United States of America Patent
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Jul 14, 1992
Grant Date -
N/A
app pub date -
Mar 4, 1991
filing date -
Mar 4, 1991
priority date (Note) -
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Abstract
A thin film package is formed using a lost cost TAB interconnection on a semiconductor device and sandwiching the device between thin films of plastic to form a sealed, thin, light weight package for the semiconductor device.
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