Method and apparatus for holding and conveying platelike substrates
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United States of America Patent
Stats
-
Jul 28, 1992
Grant Date -
N/A
app pub date -
May 21, 1990
filing date -
Mar 5, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of handling and securing platelike substrates, such as wafers, is described in which a substrate is gripped between supporting elements situated opposite each other in the plane of the substrate to be applied against opposite side edges of the substrate. The gripping forces are applied through resilient means in order to limit the gripping force applied. Apparatus for gripping a substrate in accordance with this method has the supporting element or elements on one side in a fixed position and the other movable towards the substrate to apply the gripping force, the resillient means being disposed between said other element or elements and the driving means for said movement. There is also described an optical sensing system for positioning the supporting element relative to a substrate.
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